TXGA FWF25001-S06S22W1B
Manufacturer:
TXGA
Asian Brands
Mfr. Part #:
FWF25001-S06S22W1B
Package:
Through Hole,P=2.5mm
Customer #:
Key Attributes:
Wire to Board (Wafer), Pitch 2.5mm 180° Vertical (DIP)
Description:
1x6P 1 2.5mm 6P -40℃~+85℃ 6 3A 250V Through Hole,P=2.5mm Headers, Male Pins RoHS
Datasheet:
TXGA FWF25001-S06S22W1B
Products Specifications
Manufacturer:
Package:
Through Hole,P=2.5mm
Y-Width of Bottom Edge on Board:
5.7mm
Pins Structure:
1x6P
Contact Material:
Brass
Color:
White
Number of Rows:
1
Mounting Type:
Through Hole
Pitch:
2.5mm
Number of PINs:
6P
Operating Temperature:
-40℃~+85℃
Number of PINs Per Row:
6
Current Rating:
3A
Contact Plating:
Tin
Voltage Rating (Max):
250V
Z-Height of the Board:
7mm
Additional Information
| Type | Details |
|---|---|
| Minimum | 20 |
| Multiple | 20 |
| Standard Packaging | 1000 |
| Sales Unit | Piece |
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TXGA Industrial Electronics (S.Z.) Co., Ltd is one of the leading suppliers of connector solutions, providing customized connectors and technology-oriented services with wide applicability.
Our partners are in automotive, military, new energy, aviation and other areas with high-level safety and quality standards.
We believe that the long-term development of TXGA depends on both deep insights into the future and down-to-earth actions.
We have been rewarded the title of "National Hight-tech Enterprise", and obtained a range of patents and certificates with domestic and international standards.
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