Hanbo Electronic WAFER-MX300ZZ-25A
Manufacturer:
Hanbo Electronic
Asian Brands
Mfr. Part #:
WAFER-MX300ZZ-25A
Package:
Through Hole,P=3mm
Customer #:
Key Attributes:
CONN HEADER TH 3mm
Description:
Connector Header 3mm Pitch 5A Through Hole -25℃~+85℃
Datasheet:
Hanbo Electronic WAFER-MX300ZZ-25A
Products Specifications
Manufacturer:
Package:
Through Hole,P=3mm
Y-Width of Bottom Edge on Board:
6.8mm
Flame Retardant Rating:
UL94V-0
Pins Structure:
2x5P
Pitch:
3mm
Contact Material:
Brass;PA66
Voltage Rating (Max):
250V
Number of PINs Per Row:
5
Number of Rows:
2
Row Spacing:
3mm
Z-Height of the Board:
9.9mm
Operating Temperature:
-25℃~+85℃
Mounting Type:
Through Hole
Additional Information
| Type | Details |
|---|---|
| Minimum | 5 |
| Multiple | 5 |
| Standard Packaging | 1000 |
| Sales Unit | Piece |
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS |
|
| ECCN | - |
| CNHTS | 8536901100 |
| USHTS | 8536908585 |
| TARIC | 8536901000 |
| CAHTS | 8536900090 |
| BRHTS | 85369010 |
| INHTS | 85369010 |
| MXHTS | 8536.90.11 |
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Hanbo Electronic
2080 Products
Dongguan Hanbo Electronic Technology Co., Ltd
.
(hereinafter referred to as "Hanbo Electronic") is a global manufacturer of standard parts and high-quality connector components. The company is based in the field of Card Reader connectors. Its main products include SD card holders, TF card holders, SIM card holders, all-in-one card holders, WAFER pin holders, touch switches, USB 2.0 connectors, USB 3.0 connectors, USB TYPE C 3.1 connectors and other reliable connectors and customized parts. The products are used in home appliances, mobile phones, digital cameras, Internet phones, POS machines, automobiles, industry, the Internet of Things, wearable devices, medical treatment, telecommunications, consumer products, aerospace and POS terminal instrument control panels, etc. Hanbo Electronic fully implements the ISO9001 environmental management system and the safety production standardization system, and runs the ERP enterprise resource planning management system throughout the process to
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