CONNFLY Elec DS1073-07-2x2MR6BR
Manufacturer:
CONNFLY Elec
Asian Brands
Mfr. Part #:
DS1073-07-2x2MR6BR
Package:
SMD,P=3mm,Surface Mount,Right Angle
Customer #:
Key Attributes:
3.0mm Micro ATX Connector
Description:
Tin Copper alloy 3mm 12 2 3mm -25℃~+85℃ SMD,P=3mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Datasheet:
CONNFLY Elec DS1073-07-2x2MR6BR
Products Specifications
Manufacturer:
Package:
SMD,P=3mm,Surface Mount,Right Angle
Y-Width of Bottom Edge on Board:
15.3mm
Contact Plating:
Tin
Contact Material:
Copper alloy
Pitch:
3mm
Number of PINs Per Row:
12
Number of Rows:
2
X-Length of Bottom Edge on Board (Spacing Line):
9.65mm
Row Spacing:
3mm
Z-Height of the Board:
8.75mm
Operating Temperature:
-25℃~+85℃
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 300 |
| Sales Unit | Piece |
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | - |
| CNHTS | 8536901100 |
| USHTS | 8536908585 |
| TARIC | 8536901000 |
| CAHTS | 8536900090 |
| BRHTS | 85369010 |
| INHTS | 85369010 |
| MXHTS | 8536.90.11 |
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CONNFLY Elec
1183 Products
Connfly Electronic Co., Ltd.
(hereinafter referred to as "Connfly" or "CONNFLY Elec") was founded in 2006, mainly engaged in the R&D, production, and sales of connectors and wire products in various fields. The company has passed ISO9001 quality management system certification, ISO14001 environmental system certification, OHSAS18001 occupational health and safety system certification, and IATF16949 automotive quality management system certification. The products have passed certifications such as CE, FCC, and UL. The company's products include pins, buses, connectors, switches, FPC, FFC, various electronic wires, network sockets, wafers, wiring wires, etc. The products produced by the company meet the requirements of Rohs2.0 and the REACH environmental protection directive. Products are widely used in new energy, 5G networks, automotive electronics, heavy industrial waterproofing equipment, and medical fields.
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